Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits. Scope of the Report: This report focuses on the Electronic Potting & Encapsulating in Europe market, especially in Germany, UK, France, Russia, and Italy. This report categorizes the market based on manufacturers, countries, type and application. Market Segment by Manufacturers, this report covers Henkel Dow Corning Hitachi Chemical LORD Corporation Huntsman Corporation ITW Engineered Polymers 3M H.B. Fuller John C. Dolph Master Bond ACC Silicones Epic Resins Plasma Ruggedized Solutions Market Segment by Countries, covering Germany UK France Russia Italy Market Segment by Type, covers Silicones Epoxy Polyurethane Others Market Segment by Applications, can be divided into Consumer Electronics Automotive Medical Telecommunications Others There are 17 Chapters to deeply display the Europe Electronic Potting & Encapsulating market. Chapter 1, to describe Electronic Potting & Encapsulating Introduction, product type and application, market overview, market analysis by countries, market opportunities, market risk, market driving force; Chapter 2, to analyze the manufacturers of Electronic Potting & Encapsulating, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017; Chapter 3, to display the competitive situation among the top manufacturers in Europe, with sales, revenue and market share in 2016 and 2017; Chapter 4, to show the Europe market by countries, covering Germany, UK, France, Italy and Russia, with sales, price, revenue and market share of Electronic Potting & Encapsulating, for each country, from 2012 to 2017; Chapter 5 and 6, to show the market by type and application, with sales, price, revenue, market share and growth rate by type and application, from 2012 to 2017; Chapter 7, 8, 9, 10 and 11, to analyze the key countries by manufacturers, Type and Application, covering Germany, UK, France, Italy and Russia, with sales, revenue and market share by manufacturers, types and applications; Chapter 12, Electronic Potting & Encapsulating market forecast, by countries, type and application, with sales, price, revenue and growth rate forecast, from 2017 to 2022; Chapter 13, to analyze the manufacturing cost, key raw materials and manufacturing process etc. Chapter 14, to analyze the industrial chain, sourcing strategy and downstream end users (buyers); Chapter 15, to describe Electronic Potting & Encapsulating sales channel, distributors, traders, dealers etc. Chapter 16 and 17, to describe Electronic Potting & Encapsulating Research Findings and Conclusion, Appendix, methodology and data source
Table of Contents 1 Market Overview 1.1 Electronic Potting & Encapsulating Introduction 1.2 Market Analysis by Type 1.2.1 Silicones 1.2.2 Epoxy 1.2.3 Polyurethane 1.2.4 Others 1.3 Market Analysis by Applications 1.3.1 Consumer Electronics 1.3.2 Automotive 1.3.3 Medical 1.3.4 Telecommunications 1.3.5 O
