Summary Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding.? Market Segment as follows: By Type Fully Automatic Semi-automatic Manual By Application Integrated Device Manufacturers (IDMs) Outsourced Semiconductor Assembly and Test (OSAT) By Company ASM Pacific Technology (ASMPT) Kulicke & Soffa Hesse Cho-Onpa F&K Delvotec Bondtechnik Palomar Technologies DIAS Automation West-Bond Hybond TPT The main contents of the report including: Section 1: Product definition, type and application, global and China market overview; Section 2: Global and China Market competition by company; Section 3: Global and China sales revenue, volume and price by type; Section 4: Global and China sales revenue, volume and price by application; Section 5: China export and import; Section 6: Company information, business overview, sales data and product specifications; Section 7: Industry chain and raw materials; Section 8: SWOT and Porter's Five Forces; Section 9: Conclusion.
Table of Contents 1 Market Overview 1.1 Market Segment Overview 1.1.1 Product Definition 1.1.2 Market by Type 1.1.2.1 Fully Automatic 1.1.2.2 Semi-automatic 1.1.2.3 Manual 1.1.3 Market by Application 1.1.3.1 Integrated Device Manufacturers (IDMs) 1.1.3.2 Outsourced Semiconductor Assembly and Test (OSAT) 1.2
