Summary Epi/chip. Epitaxy refers to the process of evolving a wafer (sapphire or SiC, for instance) by depositing epitaxial layers on the wafer using MOCVD. Creating the epitaxial layers is the most critical and capital-intensive step in LED manufacturing. After additional wafer processing to create the metal connection, the wafer is cut up (""diced"") into chips. Although it can be used for different applications, the quality requirements (mainly efficacy) of the epi/chip differ by application.Module (sometimes called light engine). Creation of a module (light engine) is the next step in the LED lighting value chain. The module (light engine) mainly consists of one or more LED packages, secondary optics, a heat sink and an electrical driver. The LEDs are mounted on a PCB (printed circuit board), and the modules (light engines) are integrated with optics and thermal/power management components to optimize the module (light engine) to each application. Market Segment as follows: By Region Asia-Pacific North America Europe South America Middle East & Africa By Type Lateral Chip Vertical Chip Flip Chip By Application General Lighting Automotive Lighting Backlighting By Company Epistar San?an Opto Cree OSRAM Samsung Toyoda Gosei Seoul Semiconductor Philips Lumileds ETI LG Innotek NiChia HC SemiTek Lextar Lattice Power OPTO-TECH Tyntek Genesis Photonics Formosa Epitaxy Changelight Aucksun TongFang The main contents of the report including: Section 1: Product definition, type and application, global and regional market overview; Section 2: Global and regional Market competition by company; Section 3: Global and regional sales revenue, volume and price by type; Section 4: Global and regional sales revenue, volume and price by application; Section 5: Regional export and import; Section 6: Company information, business overview, sales data and product specifications; Section 7: Industry chain and raw materials; Section 8: SWOT and Porter's Five Forces; Section 9: Conclusion.
Table of Contents 1 Market Overview 1.1 Market Segment Overview 1.1.1 Product Definition 1.1.2 Market by Type 1.1.2.1 Lateral Chip 1.1.2.2 Vertical Chip 1.1.2.3 Flip Chip 1.1.3 Market by Application 1.1.3.1 General Lighting 1.1.3.2 Automotive Lighting 1.1.3.3 Backlighting 1.2 Global and Regional
