Summary Lead Frame, as the foundation of semiconductor packaging material, is a metal frame which provides support for an integrated circuit chip or die, and with the aids of bonding material (wire, aluminum wire, copper wire), lead frame is electrical lead to interconnect the integrated circuit on the die or chip to other electrical components or contacts. The main function of lead frame is for the circuit connection, heat dissipation, mechanical support, and so on. Market Segment as follows: By Type Stamping Process Lead Frame Etching Process Lead Frame Others By Application Integrated Circuit Discrete Device Others By Company SH Materials Mitsui High-tec SDI Shinko ASM Assembly Materials Limited Samsung POSSEHL I-Chiun Enomoto Dynacraft industries DNP LG Innotek Kangqiang Hualong Jentech The main contents of the report including: Section 1: Product definition, type and application, global and United States market overview; Section 2: Global and United States Market competition by company; Section 3: Global and United States sales revenue, volume and price by type; Section 4: Global and United States sales revenue, volume and price by application; Section 5: United States export and import; Section 6: Company information, business overview, sales data and product specifications; Section 7: Industry chain and raw materials; Section 8: SWOT and Porter's Five Forces; Section 9: Conclusion.
Table of Contents 1 Market Overview 1.1 Market Segment Overview 1.1.1 Product Definition 1.1.2 Market by Type 1.1.2.1 Stamping Process Lead Frame 1.1.2.2 Etching Process Lead Frame 1.1.2.3 Others 1.1.3 Market by Application 1.1.3.1 Integrated Circuit 1.1.3.2 Discrete Device 1.1.3.3 Others 1.2 Gl
