This report studies the Electronic Packaging Materials market. Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit. Electronic packaging refers to the enclosure for integrated circuit (IC) chips, passive devices, the fabrication of circuit cards and the production of a final product or system. Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. According to our (Global Info Research) latest study, the global Electronic Packaging Materials market size was valued at USD 5643.5 million in 2022 and is forecast to a readjusted size of USD 6791 million by 2029 with a CAGR of 2.7% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes. The leading manufacturers of electronic packaging materials include Sumitomo Chemical, Shinko Electric Industries, Toppan, Tanaka, Mitsui High-Tec and others, with the top three accounting for about 25% of the market. China is the main market, accounting for about 40%, followed by the United States, accounting for about 15%. This report is a detailed and comprehensive analysis for global Electronic Packaging Materials market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided. Key Features: Global Electronic Packaging Materials market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2018-2029 Global Electronic Packaging Materials market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2018-2029 Global Electronic Packaging Materials market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (USD/Unit), 2018-2029 Global Electronic Packaging Materials market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (USD/Unit), 2018-2023 The Primary Objectives in This Report Are: To determine the size of the total market opportunity of global and key countries To assess the growth potential for Electronic Packaging Materials To forecast future growth in each product and end-use market To assess competitive factors affecting the marketplace This report profiles key players in the global Electronic Packaging Materials market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DuPont, Evonik, EPM, Mitsubishi Chemical and Sumitomo Chemical, etc. This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence. Market Segmentation Electronic Packaging Materials market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets. Market segment by Type Metal Packages Plastic Packages Ceramic Packages Market segment by Application Semiconductor & IC PCB Others Major players covered DuPont Evonik EPM Mitsubishi Chemical Sumitomo Chemical Mitsui High-tec Tanaka Shinko Electric Industries Panasonic Hitachi Chemical Kyocera Chemical Gore BASF Henkel AMETEK Electronic Toray Maruwa Leatec Fine Ceramics NCI Chaozhou Three-Circle Nippon Micrometal Toppan Dai Nippon Printing Possehl Ningbo Kangqiang Market segment by region, regional analysis covers North America (United States, Canada and Mexico) Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe) Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia) South America (Brazil, Argentina, Colombia, and Rest of South America) Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa) The content of the study subjects, includes a total of 15 chapters: Chapter 1, to describe Electronic Packaging Materials product scope, market overview, market estimation caveats and base year. Chapter 2, to profile the top manufacturers of Electronic Packaging Materials, with price, sales, revenue and global market share of Electronic Packaging Materials from 2018 to 2023. Chapter 3, the Electronic Packaging Materials competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast. Chapter 4, the Electronic Packaging Materials breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029. Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029. Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Electronic Packaging Materials market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029. Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War. Chapter 13, the key raw materials and key suppliers, and industry chain of Electronic Packaging Materials. Chapter 14 and 15, to describe Electronic Packaging Materials sales channel, distributors, customers, research findings and conclusion.
1 Market Overview 1.1 Product Overview and Scope of Electronic Packaging Materials 1.2 Market Estimation Caveats and Base Year 1.3 Market Analysis by Type 1.3.1 Overview: Global Electronic Packaging Materials Consumption Value by Type: 2018 Versus 2022 Versus 2029 1.3.2 Metal Packages 1.3.3 Plastic Packages 1.3.4 Ceramic Packages 1.4 Market Analysis
