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Global Hot-Melt Based Packaging Adhesives Market Data Survey Report 2013-2025

Summary The hot melt adhesives are defined as adhesives that melt and flow on application of heat and solidify on cooling to give a strong adhesion. They are applied in a molten state at temperatures that range from 120?C to 180?C depending on applications and materials to be bonded. The global Hot-Melt Based Packaging Adhesives market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including: Global market size and forecast Regional market size, production data and export & import Key manufacturers profile, products & services, sales data of business Global market size by Major Application Global market size by Major Type Key manufacturers are included based on company profile, sales data and product specifications etc.: H. B. Fuller Henkel Bostik (Arkema) 3M Sika Beardow Adams Jowat Avery Dennison Adtek Malaysia Cherng Tay Technology Star Bond (Thailand) Makro Rekat Sekawa Yenom PT.MORESCO MACRO ADHESIVE Tex Year Industries Nan Pao Paramelt Major applications as follows: Case & Carton Plastic Packaging Labeling Line Packaging Others Major Type as follows: EVA HMA SBC HMA PA HMA APAO HMA POE HMA Regional market size, production data and export & import: Asia-Pacific North America Europe South America Middle East & Africa
Table of Contents 1 Global Market Overview 1.1 Scope of Statistics 1.1.1 Scope of Products 1.1.2 Scope of Manufacturers 1.1.3 Scope of Application 1.1.4 Scope of Type 1.1.5 Scope of Regions/Countries 1.2 Global Market Size 2 Regional Market 2.1 Regional Production 2.2 Regional Demand 2.3 Regional Trade 3 Key Manufacturers 3.1 H. B. Fu
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About this Report
Report ID 194516
Category
  • Chemicals and Materials
Published on 13-Apr
Number of Pages 77
Publisher Name HeyReport
Editor Rating
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