Low pressure molding with polyamides is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. It is also used for sealing connectors and molding grommets and strain reliefs. Scope of the Report: This report focuses on the Low Pressure Molding with Polya
Table of Contents 1 Market Overview 1.1 Low Pressure Molding with Polyamides Introduction 1.2 Market Analysis by Type 1.2.1 Black Type 1.2.2 Amber Type 1.2.3 Others 1.3 Market Analysis by Applications 1.3.1 Electronics 1.3.2 Automotive 1.3.3 Textile industry 1.3.4 Others 1.4 Market Analysis by Regions 1.