Summary Low pressure molding with polyamides is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. It is also used for sealing connectors and molding grommets and strain reliefs. The global Low Pressure Molding with Polyamides market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including: Global market size and forecast Regional market size, production data and export & import Key manufacturers profile, products & services, sales data of business Global market size by Major Application Global market size by Major Type Key manufacturers are included based on company profile, sales data and product specifications etc.: Henkel Bostik MoldMan SUNTIP Austromelt Rixin Fine Synthetic Material Taiyu Alwayseal Technology KY Chemical Major applications as follows: Electronics Automotive Textile industry Others Major Type as follows: Black Type Amber Type Others Regional market size, production data and export & import: Asia-Pacific North America Europe South America Middle East & Africa
Table of Contents 1 Global Market Overview 1.1 Scope of Statistics 1.1.1 Scope of Products 1.1.2 Scope of Manufacturers 1.1.3 Scope of Application 1.1.4 Scope of Type 1.1.5 Scope of Regions/Countries 1.2 Global Market Size 2 Regional Market 2.1 Regional Production 2.2 Regional Demand 2.3 Regional Trade 3 Key Manufacturers 3.1 Henkel