Summary Multilayer printed-wiring boards are made from the same base material with copper foil on the top & bottom and one or more?inner layer?cores. The number of ?layers? corresponds to the number of copper foil layers. The global Multilayer Printed-wiring Board market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including: Global market size and forecast Regional market size, production data and export & import Key manufacturers profile, products & services, sales data of business Global market size by Major Application Global market size by Major Type Key manufacturers are included based on company profile, sales data and product specifications etc.: Nippon Mektron Zhen Ding Technology Unimicron Young Poong Group Samsung Electro-Mechanics Ibiden Tripod TTM Technologies Sumitomo Electric SEI Daeduck Group Nanya PCB Compeq HannStar Board LG Innotek AT&S Meiko Chin-Poon Shennan WUS Major applications as follows: Consumer electronics Communications Computer related industry Automotive industry Others Major Type as follows: Layer 4~6 Layer 8~10 Layer 10+ Regional market size, production data and export & import: Asia-Pacific North America Europe South America Middle East & Africa
Table of Contents 1 Global Market Overview 1.1 Scope of Statistics 1.1.1 Scope of Products 1.1.2 Scope of Manufacturers 1.1.3 Scope of Application 1.1.4 Scope of Type 1.1.5 Scope of Regions/Countries 1.2 Global Market Size 2 Regional Market 2.1 Regional Production 2.2 Regional Demand 2.3 Regional Trade 3 Key Manufacturers 3.1 Nippon M