This report studies Power Module Packaging in Global market, especially in North America, China, Europe, Southeast Asia, Japan and India, with production, revenue, consumption, import and export in these regions, from 2012 to 2016, and forecast to 2022. This report focuses on top manufacturers in global market, with production, price, revenue and market share for each manufacturer, covering IXYS Corporation Star Automations DyDac Controls SEMIKRON Mitsubishi Electric Corporation Texas Instruments Incorporated Sanken Electric Co., Ltd. Fuji Electric Co. Ltd. Infineon Technologies AG SanRex Corporation On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into GaN Module FET Module IGBT Module SiC Module By Application, the market can be split into Wind Turbines Rail Tractions Motors Electric Vehicles Photovoltaic Equipments Other By Regions, this report covers (we can add the regions/countries as you want) North America China Europe Southeast Asia Japan India If you have any special requirements, please let us know and we will offer you the report as you want.
Table of Contents Global Power Module Packaging Market Professional Survey Report 2017 1 Industry Overview of Power Module Packaging 1.1 Definition and Specifications of Power Module Packaging 1.1.1 Definition of Power Module Packaging 1.1.2 Specifications of Power Module Packaging 1.2 Classification of Power Module Packaging 1.2.1 GaN Module 1.2.2
