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Global Semiconductor Molding Systems Market Growth 2022-2028

The so-called "Molding" refers to the molding process in which the semiconductor is electrically insulated from the outside by resin encapsulation. It protects the chip by injecting fluid resin from the gate around the semiconductor chip and curing it. Automatic molding machine refers to the fully automatic semiconductor packaging process equipment that automatically transports the lead frame from the feeding box for plastic sealing, and then removes the residual glue and then transports it to the discharging box. The prices in this report are for individual machines and do not include molds. The global market for Semiconductor Molding Systems is estimated to increase from US$ 433.6 million in 2021 to reach US$ 876.8 million by 2028, exhibiting a CAGR of 10.6% during 2022-2028. Keeping in mind the uncertainties of COVID-19 and Russia-Ukraine War, we are continuously tracking and evaluating the direct as well as the indirect influence of the pandemic on different end use sectors. These insights are included in the report as a major market contributor. Global core semiconductor molding systems manufacturers include TOWA, ASMPT etc.The top 2 companies hold a share about 70%.Japan is the largest market, with a share about 75%, followed by China and Europe with the share about 15% and 10%.In terms of product, fully automatic is the largest segment, with a share over 60%. And in terms of application, the largest application is BGA packaging, followed by wafer level packaging. Report Coverage This latest report provides a deep insight into the global Semiconductor Molding Systems market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, value chain analysis, etc. This report aims to provide a comprehensive picture of the global Semiconductor Molding Systems market, with both quantitative and qualitative data, to help readers understand how the Semiconductor Molding Systems market scenario changed across the globe during the pandemic and Russia-Ukraine War. The base year considered for analyses is 2021, while the market estimates and forecasts are given from 2022 to 2028. The market estimates are provided in terms of revenue in USD millions and volume in Units. Market Segmentation: The study segments the Semiconductor Molding Systems market and forecasts the market size by Type (Fully Automatic, Semi-automatic and Manual), by Application (Wafer Level Packaging, BGA Packaging, Flat Panel Packaging and Others), and region (APAC, Americas, Europe, and Middle East & Africa). Segmentation by type Fully Automatic Semi-automatic Manual Segmentation by application Wafer Level Packaging BGA Packaging Flat Panel Packaging Others Segmentation by region Americas United States Canada Mexico Brazil APAC China Japan Korea Southeast Asia India Australia Europe Germany France UK Italy Russia Middle East & Africa Egypt South Africa Israel Turkey GCC Countries Major companies covered TOWA ASMPT Besi I-PEX Yamada TAKARA TOOL & DIE Asahi Engineering Tongling Fushi Sanjia Nextool Technology DAHUA Technology Chapter Introduction Chapter 1: Scope of Semiconductor Molding Systems, Research Methodology, etc. Chapter 2: Executive Summary, global Semiconductor Molding Systems market size (sales and revenue) and CAGR, Semiconductor Molding Systems market size by region, by type, by application, historical data from 2017 to 2022, and forecast to 2028. Chapter 3: Semiconductor Molding Systems sales, revenue, average price, global market share, and industry ranking by company, 2017-2022 Chapter 4: Global Semiconductor Molding Systems sales and revenue by region and by country. Country specific data and market value analysis for the U.S., Canada, Europe, China, Japan, South Korea, Southeast Asia, India, Latin America and Middle East & Africa. Chapter 5, 6, 7, 8: Americas, APAC, Europe, Middle East & Africa, sales segment by country, by type, and type. Chapter 9: Analysis of the current market trends, market forecast, opportunities and economic trends that are affecting the future marketplace Chapter 10: Manufacturing cost structure analysis Chapter 11: Sales channel, distributors, and customers Chapter 12: Global Semiconductor Molding Systems market size forecast by region, by country, by type, and application. Chapter 13: Comprehensive company profiles of the leading players, including TOWA, ASMPT, Besi, I-PEX, Yamada, TAKARA TOOL & DIE, Asahi Engineering, Tongling Fushi Sanjia and Nextool Technology, etc. Chapter 14: Research Findings and Conclusion
1 Scope of the Report 1.1 Market Introduction 1.2 Years Considered 1.3 Research Objectives 1.4 Market Research Methodology 1.5 Research Process and Data Source 1.6 Economic Indicators 1.7 Currency Considered 2 Executive Summary 2.1 World Market Overview 2.1.1 Global Semiconductor Molding Systems Annual Sales 2017-2028 2.1.2 World Current & Future Ana
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About this Report
Report ID 1039064
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Published on 12-Sep
Number of Pages 104
Publisher Name LP Information
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