The so-called "Molding" refers to the molding process in which the semiconductor is electrically insulated from the outside by resin encapsulation. It protects the chip by injecting fluid resin from the gate around the semiconductor chip and curing it. Automatic molding machine refers to the fully automatic semiconductor packaging process equipment that automatically transports the lead frame from the feeding box for plastic sealing, and then removes the residual glue and then transports it to the discharging box. The prices in this report are for individual machines and do not include molds. LPI (LP Information)' newest research report, the ﾓSemiconductor Molding Systems Industry Forecastﾔ looks at past sales and reviews total world Semiconductor Molding Systems sales in 2022, providing a comprehensive analysis by region and market sector of projected Semiconductor Molding Systems sales for 2023 through 2029. With Semiconductor Molding Systems sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Semiconductor Molding Systems industry. This Insight Report provides a comprehensive analysis of the global Semiconductor Molding Systems landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Semiconductor Molding Systems portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms' unique position in an accelerating global Semiconductor Molding Systems market. This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Semiconductor Molding Systems and breaks down the forecast by type, by application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Semiconductor Molding Systems. The global Semiconductor Molding Systems market size is projected to grow from US$ 433.6 million in 2022 to US$ 876.8 million in 2029; it is expected to grow at a CAGR of 876.8 from 2023 to 2029. Global core semiconductor molding systems manufacturers include TOWA, ASMPT etc.The top 2 companies hold a share about 70%.Japan is the largest market, with a share about 75%, followed by China and Europe with the share about 15% and 10%.In terms of product, fully automatic is the largest segment, with a share over 60%. And in terms of application, the largest application is BGA packaging, followed by wafer level packaging. This report presents a comprehensive overview, market shares, and growth opportunities of Semiconductor Molding Systems market by product type, application, key manufacturers and key regions and countries. Market Segmentation: Segmentation by type Fully Automatic Semi-automatic Manual Segmentation by application Wafer Level Packaging BGA Packaging Flat Panel Packaging Others This report also splits the market by region: Americas United States Canada Mexico Brazil APAC China Japan Korea Southeast Asia India Australia Europe Germany France UK Italy Russia Middle East & Africa Egypt South Africa Israel Turkey GCC Countries The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration. TOWA ASMPT Besi I-PEX Yamada TAKARA TOOL & DIE Asahi Engineering Tongling Fushi Sanjia Nextool Technology DAHUA Technology Key Questions Addressed in this Report What is the 10-year outlook for the global Semiconductor Molding Systems market? What factors are driving Semiconductor Molding Systems market growth, globally and by region? Which technologies are poised for the fastest growth by market and region? How do Semiconductor Molding Systems market opportunities vary by end market size? How does Semiconductor Molding Systems break out type, application? What are the influences of COVID-19 and Russia-Ukraine war?
1 Scope of the Report 1.1 Market Introduction 1.2 Years Considered 1.3 Research Objectives 1.4 Market Research Methodology 1.5 Research Process and Data Source 1.6 Economic Indicators 1.7 Currency Considered 1.8 Market Estimation Caveats 2 Executive Summary 2.1 World Market Overview 2.1.1 Global Semiconductor Molding Systems Annual Sales 2018-2029
