The report focuses on the Smart Packaging market size, segment size (mainly covering product type, application, and geography), competitor landscape, recent status, and development trends. Furthermore, the report provides strategies for companies to overcome threats posed by COVID-19. Technological innovation and advancement will further optimize the performance of the product, enabling it to acquire a wider range of applications in the downstream market. Moreover, customer preference analysis, market dynamics (drivers, restraints, opportunities), new product release, impact of COVID-19, regional conflicts and carbon neutrality provide crucial information for us to take a deep dive into the Smart Packaging market. Major Players in the Smart Packaging market are: 3M Timestrip, PLC Sysco Corporation (Fresh Point Services) Ball Corporation Thin Film Electronics ASA Stora Enso American Thermal Instruments Bemis Company, Inc. Avery Dennison Corp. Crown Holdings Inc. BASF SE Graham Packaging Company Inc. TempTime Corporation Constar International Inc. Rexam PLC Ampacet Corporation R.R. Donnelly Sons & Company International Paper Multisorb Technologies PakSense On the basis of types, the Smart Packaging market is primarily split into: Active Packaging Intelligent Packaging Modified Atmosphere Packaging On the basis of applications, the market covers: Food & beverage Personal care Automotive Healthcare Logistics Others Major Regions or countries covered in this report: United States Europe China Japan India Southeast Asia Latin America Middle East and Africa Others Years considered for this report: Historical Years: 2017-2021 Base Year: 2021 Estimated Year: 2022 Forecast Period: 2022-2029
Table of Content 1 Smart Packaging Market Overview 1.1 Product Overview and Scope of Smart Packaging Market 1.2 Smart Packaging Market Segment by Type 1.2.1 Global Smart Packaging Market Sales and CAGR (%) Comparison by Type (2017-2029) 1.3 Global Smart Packaging Market Segment by Application 1.3.1 Smart Packaging Market Consumption (Sales) Comparison by Application (2017-2029) 1.4 Global Smart P
