Summary Sputtering is the process of forming a thin film when the object is attached to the target substrate by the sputtering and scattering, and the sputtering target is the material for high-speed particle bombardment. This report studies the sputtering target material market. The global Sputtering Target Material market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including: Global market size and forecast Regional market size, production data and export & import Key manufacturers profile, products & services, sales data of business Global market size by Major Application Global market size by Major Type Key manufacturers are included based on company profile, sales data and product specifications etc.: JX Nippon Mining & Metals Corporation TOSOH Sumitomo Chemical Mitsui Mining & Smelting ULVAC Praxair Grikin Plansee Ningbo Jiangfeng Honeywell Materion (Heraeus) Acetron Changzhou Sujing Electronic Material Luoyang Sifon Electronic Materials Major applications as follows: Semiconductor Solar Energy Flat Panel Display Major Type as follows: Metal Target Alloy Target Ceramic Compound Target Regional market size, production data and export & import: Asia-Pacific North America Europe South America Middle East & Africa
Table of Contents 1 Global Market Overview 1.1 Scope of Statistics 1.1.1 Scope of Products 1.1.2 Scope of Manufacturers 1.1.3 Scope of Application 1.1.4 Scope of Type 1.1.5 Scope of Regions/Countries 1.2 Global Market Size 2 Regional Market 2.1 Regional Production 2.2 Regional Demand 2.3 Regional Trade 3 Key Manufacturers 3.1 JX Nippo
