Global Test and Burn-in Sockets Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

The Test and Burn-in Sockets market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.
According to our (Global Info Research) latest study, due to COVID-19 pandemic, the global Test and Burn-in Sockets market size is estimated to be worth US$ 1388 million in 2021 and is forecast to a readjusted size of USD 2077.8 million by 2028 with a CAGR of 5.9% during review period. Memory accounting for % of the Test and Burn-in Sockets global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While Burn-in Socket segment is altered to a % CAGR between 2022 and 2028.
Global key manufacturers of Test and Burn-in Sockets include Yamaichi Electronics, Cohu, Enplas, ISC, and Smiths Interconnect, etc. In terms of revenue, the global top four players hold a share over % in 2021.
Market segmentation
Test and Burn-in Sockets market is split by Type and by Application. For the period 2017-2028, the growth among segments provide accurate calculations and forecasts for sales by Type and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type, covers
    Burn-in Socket
    Test Socket
Market segment by Application can be divided into
    Memory
    CMOS Image Sensor
    High Voltage
    RF
    SOC, CPU, GPU, etc.
    Other non-memory
The key market players for global Test and Burn-in Sockets market are listed below:
    Yamaichi Electronics
    Cohu
    Enplas
    ISC
    Smiths Interconnect
    LEENO
    Sensata Technologies
    Johnstech
    Yokowo
    WinWay Technology
    Loranger
    Plastronics
    OKins Electronics
    Ironwood Electronics
    3M
    M Specialties
    Aries Electronics
    Emulation Technology
    Qualmax
    Micronics
    Essai
    Rika Denshi
    Robson Technologies
    Translarity
    Test Tooling
    Exatron
    Gold Technologies
    JF Technology
    Advanced
    Ardent Concepts
Market segment by region, regional analysis covers
    North America (United States, Canada and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Test and Burn-in Sockets product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Test and Burn-in Sockets, with price, sales, revenue and global market share of Test and Burn-in Sockets from 2019 to 2022.
Chapter 3, the Test and Burn-in Sockets competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Test and Burn-in Sockets breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and Test and Burn-in Sockets market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.
Chapter 12, the key raw materials and key suppliers, and industry chain of Test and Burn-in Sockets.
Chapter 13, 14, and 15, to describe Test and Burn-in Sockets sales channel, distributors, customers, research findings and conclusion, appendix and data source.