Thermal interface material is a kind of material applied between power devices and electronic radiators. It is mainly used to fill the micro voids and uneven holes on the surface caused by the connection or contact between the two materials to improve the heat dissipation performance. Global Thermal Interface Materials key players are mainly located in US, Europe and Japan, like Dow, Panasonic, Parker Hannifin, Shin-Etsu Chemical, Laird, Henkel, Fujipoly, Tanyuan Technology and DuPont, etc. Global top five players hold a share nearly 40 percent. Market Analysis and Insights: Global Thermal Interface Materials for Electronics Cooling Market The global Thermal Interface Materials for Electronics Cooling market was valued at US$ XX in 2020 and will reach US$ XX million by the end of 2027, growing at a CAGR of XX% during 2022-2027. Global Thermal Interface Materials for Electronics Cooling Scope and Market Size The global Thermal Interface Materials for Electronics Cooling market is segmented by company, region (country), by Type, and by Application. Players, stakeholders, and other participants in the global Thermal Interface Materials for Electronics Cooling market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), by Type and by Application for the period 2016-2027. Segment by Type Greases Elastomeric Pads Thermal Tapes Phase Change Materials Other Segment by Application Electronics Power Devices Others The Thermal Interface Materials for Electronics Cooling market is analysed and market size information is provided by regions (countries). Segment by Application, the Thermal Interface Materials for Electronics Cooling market is segmented into North America, Europe, China, Japan, Southeast Asia, India and Other Regions. By Company Dow Panasonic Parker Hannifin Shin-Etsu Chemical Laird Henkel Fujipoly DuPont Aavid (Boyd Corporation) 3M Wacker H.B. Fuller Company Denka Company Limited Dexerials Corporation Tanyuan Technology Jones Tech PLC Shenzhen FRD Science & Technology
1 Thermal Interface Materials for Electronics Cooling Market Overview 1.1 Thermal Interface Materials for Electronics Cooling Product Scope 1.2 Thermal Interface Materials for Electronics Cooling Segment by Type 1.2.1 Global Thermal Interface Materials for Electronics Cooling Sales by Type (2016 & 2021 & 2027) 1.2.2 Greases 1.2.3 Elastomeric Pads 1.2.4 Therm
