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Global Underfill Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

This report studies the Underfill market, Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera. According to our (Global Info Research) latest study, the global Underfill market size was valued at USD 455.3 million in 2022 and is forecast to a readjusted size of USD 577.1 million by 2029 with a CAGR of 3.4% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes. North America is the largest market with about 38% market share. China is follower, accounting for about 20% market share. The key players are Henkel, WON CHEMICAL, NAMICS, SUNSTAR, Hitachi Chemical, Fuji, Shin-Etsu Chemical, Bondline, AIM Solder, Zymet, Panacol-Elosol, Master Bond, DOVER, Darbond, HIGHTITE, U-bond etc. Top 3 companies occupied about 45% market share. This report is a detailed and comprehensive analysis for global Underfill market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided. Key Features: Global Underfill market size and forecasts, in consumption value ($ Million), sales quantity (MT), and average selling prices (USD/MT), 2018-2029 Global Underfill market size and forecasts by region and country, in consumption value ($ Million), sales quantity (MT), and average selling prices (USD/MT), 2018-2029 Global Underfill market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (MT), and average selling prices (USD/MT), 2018-2029 Global Underfill market shares of main players, shipments in revenue ($ Million), sales quantity (MT), and ASP (USD/MT), 2018-2023 The Primary Objectives in This Report Are: To determine the size of the total market opportunity of global and key countries To assess the growth potential for Underfill To forecast future growth in each product and end-use market To assess competitive factors affecting the marketplace This report profiles key players in the global Underfill market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Henkel, WON CHEMICAL, NAMICS, SUNSTAR and Hitachi Chemical, etc. This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence. Market Segmentation Underfill market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets. Market segment by Type Semiconductor Underfills Board Level Underfills Market segment by Application Industrial Electronics Defense & Aerospace Electronics Consumer Electronics Automotive Electronics Medical Electronics Others Major players covered Henkel WON CHEMICAL NAMICS SUNSTAR Hitachi Chemical Fuji Shin-Etsu Chemical Bondline AIM Solder Zymet Panacol-Elosol Master Bond DOVER Darbond HIGHTITE U-bond Market segment by region, regional analysis covers North America (United States, Canada and Mexico) Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe) Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia) South America (Brazil, Argentina, Colombia, and Rest of South America) Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa) The content of the study subjects, includes a total of 15 chapters: Chapter 1, to describe Underfill product scope, market overview, market estimation caveats and base year. Chapter 2, to profile the top manufacturers of Underfill, with price, sales, revenue and global market share of Underfill from 2018 to 2023. Chapter 3, the Underfill competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast. Chapter 4, the Underfill breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029. Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029. Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Underfill market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029. Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War. Chapter 13, the key raw materials and key suppliers, and industry chain of Underfill. Chapter 14 and 15, to describe Underfill sales channel, distributors, customers, research findings and conclusion.
1 Market Overview 1.1 Product Overview and Scope of Underfill 1.2 Market Estimation Caveats and Base Year 1.3 Market Analysis by Type 1.3.1 Overview: Global Underfill Consumption Value by Type: 2018 Versus 2022 Versus 2029 1.3.2 Semiconductor Underfills 1.3.3 Board Level Underfills 1.4 Market Analysis by Application 1.4.1 Overview: Global Underfill C
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About this Report
Report ID 28938
Category
  • Electronics
Published on 01-Jan
Number of Pages 117
Publisher Name Global Info Research
Editor Rating
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