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Global Wafer-level Packaging Equipment Market Insights and Forecast to 2027

Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process. In the recent years, wafer-level packaging equipment production value showed a trend of steady growth. At present, the major manufacturers of wafer-level packaging equipment are concentrated in North America, EU, and Japan. Applied Materials is the world's largest wafer-level packaging equipment producer. Market Analysis and Insights: Global Wafer-level Packaging Equipment Market The global Wafer-level Packaging Equipment market is valued at US$ 2418.4 million in 2019. The market size will reach US$ 4508.2 million by the end of 2026, growing at a CAGR of 9.2% during 2021-2026. Global Wafer-level Packaging Equipment Scope and Segment Wafer-level Packaging Equipment market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Wafer-level Packaging Equipment market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type and by Application for the period 2016-2027. Segment by Type Fan In Fan Out Segment by Application Integrated Circuit Fabrication Process Semiconductor Industry Microelectromechanical Systems (MEMS) Other By Company Applied Materials Tokyo Electron KLA-Tencor Corporation EV Group Tokyo Seimitsu Disco SEMES Suss Microtec Veeco/CNT Rudolph Technologies Production by Region North America Europe China Japan Consumption by Region North America U.S. Canada Europe Germany France U.K. Italy Russia Asia-Pacific China Japan South Korea India Australia Taiwan Indonesia Thailand Malaysia Philippines Vietnam Latin America Mexico Brazil Argentina Middle East & Africa Turkey Saudi Arabia U.A.E
1 Study Coverage 1.1 Wafer-level Packaging Equipment Product Introduction 1.2 Market by Type 1.2.1 Global Wafer-level Packaging Equipment Market Size Growth Rate by Type 1.2.2 Fan In 1.2.3 Fan Out 1.3 Market by Application 1.3.1 Global Wafer-level Packaging Equipment Market Size Growth Rate by Application 1.3.2 Integrated Circuit Fabrication Proc
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About this Report
Report ID 441964
Category
  • Equipment
Published on 21-Oct
Number of Pages 115
Publisher Name QY Research
Editor Rating
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