This report studies the Wire Wedge Bonder Equipment market status and outlook of global and major regions, from angles of manufacturers, regions, product types and end industries; this report analyzes the top manufacturers in global and major regions, and splits the Wire Wedge Bonder Equipment market by product type and applications/end industries. Compared to 2015, Wire Wedge Bonder Equipment market increased sales by 1.28 percent to 90.23 million USD worldwide in 2016 from 89.09 million USD in 2015. It shows that the Wire Wedge Bonder Equipment market performance is positive, despite the weak economic environment. The global Wire Wedge Bonder Equipment market is expected to reach $96.62 million by 2022 from $91.73 million in 2017, growing at a CAGR of 1.04% from 2017 to 2022. The major players in global Wire Wedge Bonder Equipment market include Kulicke & Soffa ASM Pacific Technology (ASMPT) Hesse Cho-Onpa F&K Delvotec Bondtechnik Palomar Technologies DIAS Automation West-Bond Hybond TPT Geographically, this report is segmented into several key Regions, with production, consumption, revenue, market share and growth rate of Wire Wedge Bonder Equipment in these regions, from 2012 to 2022 (forecast), covering North America Europe China Singapore ROW On the basis of product, the Wire Wedge Bonder Equipment market is primarily split into Fully Automatic Semi-automatic Manual On the basis on the end users/applications, this report covers Integrated Device Manufacturers (IDMs) Outsourced Semiconductor Assembly and Test (OSAT)
Table of Contents 1 Wire Wedge Bonder Equipment Market Overview 1 1.1 Product Overview and Scope of Wire Wedge Bonder Equipment 1 1.2 Wire Wedge Bonder Equipment Segment by Types (Product Category) 2 1.2.1 Global Wire Wedge Bonder Equipment Production (Unit) and Growth Rate (%) Comparison by Types (2012-2022) 2 1.2.2 Global Wire Wedge Bonder Equipment Production Market Share (%) by Types in
