Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits. Scope of the Report: This report focuses on the Electronic Potting & Encapsulating in North America market, especially in United States, Canada and Mexico. This report categorizes the market based on manufacturers, countries, type and application. Market Segment by Manufacturers, this report covers Henkel Dow Corning Hitachi Chemical LORD Corporation Huntsman Corporation ITW Engineered Polymers 3M H.B. Fuller John C. Dolph Master Bond ACC Silicones Epic Resins Plasma Ruggedized Solutions Market Segment by Countries, covering United States Canada Mexico Market Segment by Type, covers Silicones Epoxy Polyurethane Others Market Segment by Applications, can be divided into Consumer Electronics Automotive Medical Telecommunications Others There are 15 Chapters to deeply display the North America Electronic Potting & Encapsulating market. Chapter 1, to describe Electronic Potting & Encapsulating Introduction, product type and application, market overview, market analysis by countries, market opportunities, market risk, market driving force; Chapter 2, to analyze the manufacturers of Electronic Potting & Encapsulating, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017; Chapter 3, to display the competitive situation among the top manufacturers, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017; Chapter 4, to show the North America market by countries, covering United States, Canada and Mexico, with sales, revenue and market share of Electronic Potting & Encapsulating, for each country, from 2012 to 2017; Chapter 5 and 6, to show the market by type and application, with sales, price, revenue, market share and growth rate by type, application, from 2012 to 2017; Chapter 7, 8 and 9, to analyze the segment market in United States, Canada and Mexico, by manufacturers, type and application, with sales, price, revenue and market share by manufacturers, types and applications; Chapter 10, Electronic Potting & Encapsulating market forecast, by countries, type and application, with sales, price and revenue, from 2017 to 2022; Chapter 11, to analyze the manufacturing cost, key raw materials and manufacturing process etc. Chapter 12, to analyze the industrial chain, sourcing strategy and downstream end users (buyers); Chapter 13, to describe sales channel, distributors, traders, dealers etc. Chapter 14 and 15, to describe Electronic Potting & Encapsulating Research Findings and Conclusion, Appendix, methodology and data source
Table of Contents 1 Market Overview 1.1 Electronic Potting & Encapsulating Introduction 1.2 Market Analysis by Type 1.2.1 Silicones 1.2.2 Epoxy 1.2.3 Polyurethane 1.2.4 Others 1.3 Market Analysis by Applications 1.3.1 Consumer Electronics 1.3.2 Automotive 1.3.3 Medical 1.3.4 Telecommunications 1.3.5 O
