An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection to a wider pitch or to reroute a connection to a different connection. Scope of the Report: This report focuses on the Interposer in North America market, especially in United States, Canada and Mexico. This report categorizes the market based on manufacturers, countries, type and application. Market Segment by Manufacturers, this report covers Murata Tezzaron Xilinx AGC Electronics TSMC UMC Plan Optik AG Amkor IMT ALLVIA, Inc Market Segment by Countries, covering United States Canada Mexico Market Segment by Type, covers 2D Interposer 2.5D Interposer 3D Interposer Market Segment by Applications, can be divided into CIS CPU/GPU MEMS 3D Capping Interposer RF Devices (IPD, Filtering) Logic SoC (APE, BB/APE) ASIC/FPGA High Power LED (3D Silicon Substrate) There are 15 Chapters to deeply display the North America Interposer market. Chapter 1, to describe Interposer Introduction, product type and application, market overview, market analysis by countries, market opportunities, market risk, market driving force; Chapter 2, to analyze the manufacturers of Interposer, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017; Chapter 3, to display the competitive situation among the top manufacturers, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017; Chapter 4, to show the North America market by countries, covering United States, Canada and Mexico, with sales, revenue and market share of Interposer, for each country, from 2012 to 2017; Chapter 5 and 6, to show the market by type and application, with sales, price, revenue, market share and growth rate by type, application, from 2012 to 2017; Chapter 7, 8 and 9, to analyze the segment market in United States, Canada and Mexico, by manufacturers, type and application, with sales, price, revenue and market share by manufacturers, types and applications; Chapter 10, Interposer market forecast, by countries, type and application, with sales, price and revenue, from 2017 to 2022; Chapter 11, to analyze the manufacturing cost, key raw materials and manufacturing process etc. Chapter 12, to analyze the industrial chain, sourcing strategy and downstream end users (buyers); Chapter 13, to describe sales channel, distributors, traders, dealers etc. Chapter 14 and 15, to describe Interposer Research Findings and Conclusion, Appendix, methodology and data source
Table of Contents 1 Market Overview 1.1 Interposer Introduction 1.2 Market Analysis by Type 1.2.1 2D Interposer 1.2.2 2.5D Interposer 1.2.3 3D Interposer 1.3 Market Analysis by Applications 1.3.1 CIS 1.3.2 CPU/GPU 1.3.3 MEMS 3D Capping Interposer 1.3.4 RF Devices (IPD, Filtering) 1.3.5 Logic SoC (APE, BB/APE)
