Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding. Scope of the Report: This report focuses on the Wire Wedge Bonder Equipment in North America market, especially in United States, Canada and Mexico. This report categorizes the market based on manufacturers, countries, type and application. Market Segment by Manufacturers, this report covers Kulicke & Soffa ASM Pacific Technology (ASMPT) Hesse Cho-Onpa F&K Delvotec Bondtechnik Palomar Technologies DIAS Automation West-Bond Hybond TPT Market Segment by Countries, covering United States Canada Mexico Market Segment by Type, covers Fully Automatic Semi-automatic Manual Market Segment by Applications, can be divided into Integrated Device Manufacturers (IDMs) Outsourced Semiconductor Assembly and Test (OSAT) There are 15 Chapters to deeply display the North America Wire Wedge Bonder Equipment market. Chapter 1, to describe Wire Wedge Bonder Equipment Introduction, product type and application, market overview, market analysis by countries, market opportunities, market risk, market driving force; Chapter 2, to analyze the manufacturers of Wire Wedge Bonder Equipment, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017; Chapter 3, to display the competitive situation among the top manufacturers, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017; Chapter 4, to show the North America market by countries, covering United States, Canada and Mexico, with sales, revenue and market share of Wire Wedge Bonder Equipment, for each country, from 2012 to 2017; Chapter 5 and 6, to show the market by type and application, with sales, price, revenue, market share and growth rate by type, application, from 2012 to 2017; Chapter 7, 8 and 9, to analyze the segment market in United States, Canada and Mexico, by manufacturers, type and application, with sales, price, revenue and market share by manufacturers, types and applications; Chapter 10, Wire Wedge Bonder Equipment market forecast, by countries, type and application, with sales, price and revenue, from 2017 to 2022; Chapter 11, to analyze the manufacturing cost, key raw materials and manufacturing process etc. Chapter 12, to analyze the industrial chain, sourcing strategy and downstream end users (buyers); Chapter 13, to describe sales channel, distributors, traders, dealers etc. Chapter 14 and 15, to describe Wire Wedge Bonder Equipment Research Findings and Conclusion, Appendix, methodology and data source
Table of Contents 1 Market Overview 1.1 Wire Wedge Bonder Equipment Introduction 1.2 Market Analysis by Type 1.2.1 Fully Automatic 1.2.2 Semi-automatic 1.2.3 Manual 1.3 Market Analysis by Applications 1.3.1 Integrated Device Manufacturers (IDMs) 1.3.2 Outsourced Semiconductor Assembly and Test (OSAT) 1.4 Market Analysis by Countries
