Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits. Scope of the Report: This report focuses on the Electronic Potting & Encapsulating in United States market, to split the market based on manufacturers, states, type and application. Market Segment by Manufacturers, this report covers Henkel Dow Corning Hitachi Chemical LORD Corporation Huntsman Corporation ITW Engineered Polymers 3M H.B. Fuller John C. Dolph Master Bond ACC Silicones Epic Resins Plasma Ruggedized Solutions Market Segment by States, covering California Texas New York Florida Illinois Market Segment by Type, covers Silicones Epoxy Polyurethane Others Market Segment by Applications, can be divided into Consumer Electronics Automotive Medical Telecommunications Others There are 17 Chapters to deeply display the United States Electronic Potting & Encapsulating market. Chapter 1, to describe Electronic Potting & Encapsulating Introduction, product type and application, market overview, market analysis by States, market opportunities, market risk, market driving force; Chapter 2, to analyze the manufacturers of Electronic Potting & Encapsulating, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017; Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017; Chapter 4, to show the United States market by States, covering California, New York, Texas, Illinois and Florida, with sales, price, revenue and market share of Electronic Potting & Encapsulating, for each state, from 2012 to 2017; Chapter 5 and 6, to show the market by type and application, with sales, price, revenue, market share and growth rate by type, application, from 2012 to 2017; Chapter 7, 8, 9, 10 and 11, to analyze the key States by Type and Application, covering California, New York, Texas, Illinois and Florida, with sales, revenue and market share by types and applications; Chapter 12, Electronic Potting & Encapsulating market forecast, by States, type and application, with sales, price, revenue and growth rate forecast, from 2017 to 2022; Chapter 13, to analyze the manufacturing cost, key raw materials and manufacturing process etc. Chapter 14, to analyze the industrial chain, sourcing strategy and downstream end users (buyers); Chapter 15, to describe sales channel, distributors, traders, dealers etc. Chapter 16 and 17, to describe Electronic Potting & Encapsulating Research Findings and Conclusion, Appendix, methodology and data source.
Table of Contents 1 Market Overview 1.1 Electronic Potting & Encapsulating Introduction 1.2 Market Analysis by Type 1.2.1 Silicones 1.2.2 Epoxy 1.2.3 Polyurethane 1.2.4 Others 1.3 Market Analysis by Applications 1.3.1 Consumer Electronics 1.3.2 Automotive 1.3.3 Medical 1.3.4 Telecommunications 1.3.5 O
