Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding. Scope of the Report: This report focuses on the Wire Wedge Bonder Equipment in United States market, to split the market based on manufacturers, states, type and application. Market Segment by Manufacturers, this report covers Kulicke & Soffa ASM Pacific Technology (ASMPT) Hesse Cho-Onpa F&K Delvotec Bondtechnik Palomar Technologies DIAS Automation West-Bond Hybond TPT Market Segment by States, covering California Texas New York Florida Illinois Market Segment by Type, covers Fully Automatic Semi-automatic Manual Market Segment by Applications, can be divided into Integrated Device Manufacturers (IDMs) Outsourced Semiconductor Assembly and Test (OSAT) There are 17 Chapters to deeply display the United States Wire Wedge Bonder Equipment market. Chapter 1, to describe Wire Wedge Bonder Equipment Introduction, product type and application, market overview, market analysis by States, market opportunities, market risk, market driving force; Chapter 2, to analyze the manufacturers of Wire Wedge Bonder Equipment, with profile, main business, news, sales, price, revenue and market share in 2016 and 2017; Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017; Chapter 4, to show the United States market by States, covering California, New York, Texas, Illinois and Florida, with sales, price, revenue and market share of Wire Wedge Bonder Equipment, for each state, from 2012 to 2017; Chapter 5 and 6, to show the market by type and application, with sales, price, revenue, market share and growth rate by type, application, from 2012 to 2017; Chapter 7, 8, 9, 10 and 11, to analyze the key States by Type and Application, covering California, New York, Texas, Illinois and Florida, with sales, revenue and market share by types and applications; Chapter 12, Wire Wedge Bonder Equipment market forecast, by States, type and application, with sales, price, revenue and growth rate forecast, from 2017 to 2022; Chapter 13, to analyze the manufacturing cost, key raw materials and manufacturing process etc. Chapter 14, to analyze the industrial chain, sourcing strategy and downstream end users (buyers); Chapter 15, to describe sales channel, distributors, traders, dealers etc. Chapter 16 and 17, to describe Wire Wedge Bonder Equipment Research Findings and Conclusion, Appendix, methodology and data source.
Table of Contents 1 Market Overview 1.1 Wire Wedge Bonder Equipment Introduction 1.2 Market Analysis by Type 1.2.1 Fully Automatic 1.2.2 Semi-automatic 1.2.3 Manual 1.3 Market Analysis by Applications 1.3.1 Integrated Device Manufacturers (IDMs) 1.3.2 Outsourced Semiconductor Assembly and Test (OSAT) 1.4 Market Analysis by States
