Summary Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding.? This report includes market status and forecast of global and major regions, with introduction of vendors, regions, product types and end industries; and this report counts product types and end industries in global and major regions. Market Segment as follows: By Region / Countries North America (U.S., Canada, Mexico) Europe (Germany, U.K., France, Italy, Russia, Spain etc) South America (Brazil, Argentina etc) Middle East & Africa (Saudi Arabia, South Africa etc) By Type Fully Automatic Semi-automatic Manual By End-User / Application Integrated Device Manufacturers (IDMs) Outsourced Semiconductor Assembly and Test (OSAT) By Company Kulicke & Soffa ASM Pacific Technology (ASMPT) Hesse Cho-Onpa F&K Delvotec Bondtechnik Palomar Technologies DIAS Automation West-Bond Hybond TPT
Table of Contents 1 Market Definition 1.1 Market Segment Overview 1.2 by Type 1.3 by End-Use / Application 2 Global Market by Vendors 2.1 Market Share 2.2 Vendor Profile 2.3 Dynamic of Vendors 3 Global Market by Type 3.1 Market Share 3.2 Introduction of End-Use by Different Products 4 Global Market by End-Use / Application 4.1 Market Share 4.2 Overview of Co
