Summary Sputtering is the process of forming a thin film when the object is attached to the target substrate by the sputtering and scattering, and the sputtering target is the material for high-speed particle bombardment. This report studies the sputtering target material market. Market Segment as follows: By Region Asia-Pacific North America Europe South America Middle East & Africa By Type Metal Target Alloy Target Ceramic Compound Target By Application Semiconductor Solar Energy Flat Panel Display By Company JX Nippon Mining & Metals Corporation TOSOH Sumitomo Chemical Mitsui Mining & Smelting ULVAC Praxair Grikin Plansee Ningbo Jiangfeng Honeywell Materion (Heraeus) Acetron Changzhou Sujing Electronic Material Luoyang Sifon Electronic Materials The main contents of the report including: Section 1: Product definition, type and application, global and regional market overview; Section 2: Global and regional Market competition by company; Section 3: Global and regional sales revenue, volume and price by type; Section 4: Global and regional sales revenue, volume and price by application; Section 5: Regional export and import; Section 6: Company information, business overview, sales data and product specifications; Section 7: Industry chain and raw materials; Section 8: SWOT and Porter's Five Forces; Section 9: Conclusion.
Table of Contents 1 Market Overview 1.1 Market Segment Overview 1.1.1 Product Definition 1.1.2 Market by Type 1.1.2.1 Metal Target 1.1.2.2 Alloy Target 1.1.2.3 Ceramic Compound Target 1.1.3 Market by Application 1.1.3.1 Semiconductor 1.1.3.2 Solar Energy 1.1.3.3 Flat Panel Display 1.2 Global and
