Summary High Density Interconnects (HDI) board is defined as a board (PCB) with a higher wiring density per Unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 ?m), smaller vias (<150 ?m) and capture pads (<400 ?m), I/O>300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance. The global HDI market will reach xxx Million USD in 2019 with CAGR xx% 2019-2025. The main contents of the report including: Global market size and forecast Regional market size, production data and export & import Key manufacturers profile, products & services, sales data of business Global market size by Major Application Global market size by Major Type Key manufacturers are included based on company profile, sales data and product specifications etc.: Unimicron Compeq AT&S SEMCO Ibiden TTM ZDT Tripod DAP Unitech Multek LG Innotek Young Poong (KCC) Meiko Daeduck Major applications as follows: Consumer Electronics Telecommunications Computer & Display Vehicle Others Major Type as follows: HDI PCB (1+N+1) HDI PCB (2+N+2) ELIC (Every Layer Interconnection) Regional market size, production data and export & import: Asia-Pacific North America Europe South America Middle East & Africa
Table of Contents 1 Global Market Overview 1.1 Scope of Statistics 1.1.1 Scope of Products 1.1.2 Scope of Manufacturers 1.1.3 Scope of Application 1.1.4 Scope of Type 1.1.5 Scope of Regions/Countries 1.2 Global Market Size 2 Regional Market 2.1 Regional Production 2.2 Regional Demand 2.3 Regional Trade 3 Key Manufacturers 3.1 Unimicro
