Lithographic equipment are widely employed for printing complex circuit patterns on silicon wafers that are mainly raw materials for integrated circuits (ICs). Printing process is considered to be one of the most expensive and critical steps in wafer fabrication. The IC industry is therefore focused toward using lithographic equipment as cost-efficient enhancements in the production technology. The demand for compact electronic devices has grown in sectors like communication device, automotive, industrial manufacturing, and healthcare equipment. This trend has compelled the semiconductor IC manufacturers to invest in R&D to reduce the size and increase the performance of ICs, which in turn has led to the emergence new nanolithography equipment. The global Nanolithography Equipment market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025. This report focuses on Nanolithography Equipment volume and value at global level, regional level and company level. From a global perspective, this report represents overall Nanolithography Equipment market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan. At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report. The following manufacturers are covered: ASML Canon Leica Raith SUSS MicroTec Rolith Nanoink Optical Associates Nanonics Imaging JC Nabity Lithography Systems NIL Technolog Segment by Regions North America Europe China Japan Segment by Type ArF Dry ArF Immersion KrF EUV i-line Segment by Application Foundry Memory IDM
Table of Contents Executive Summary 1 Nanolithography Equipment Market Overview 1.1 Product Overview and Scope of Nanolithography Equipment 1.2 Nanolithography Equipment Segment by Type 1.2.1 Global Nanolithography Equipment Production Growth Rate Comparison by Type (2014-2025) 1.2.2 ArF Dry 1.2.3 ArF Immersion 1.2.4 KrF 1.2.5 EUV
