SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps. This report aims to provide a comprehensive presentation of the global market for System-in-Package, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding System-in-Package. This report contains market size and forecasts of System-in-Package in global, including the following market information: Global System-in-Package Market Revenue, 2018-2023, 2024-2029, ($ millions) Global top five companies in 2022 (%) The global System-in-Package market was valued at US$ 54440 million in 2022 and is projected to reach US$ 76960 million by 2029, at a CAGR of 5.1% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes. The emergence of advanced and compact consumer electronic devices as one of the primary growth factors for this semiconductor packaging market. The consumer electronics devices industry has witnessed a massive transformation in the recent years, where feature phones were replaced by smartphones and personal computers by laptops and tablets. Furthermore, the adoption of the smart homes concept, where electronic devices can be monitored and controlled with the help of mobile applications, will further transition this industry. This will induce electronic device manufacturers to constantly upgrade their products in terms of several factors such as design, processing power, power consumption, and user-interface, that will require the use of robust technology and develop compact devices. This demand for compact electronic devices will compel semiconductor manufacturers to develop denser ICs with increased circuitry, which will boost the demand for advanced IC packagingtechniques such as SiP. MARKET MONITOR GLOBAL, INC (MMG) has surveyed the System-in-Package companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks. Total Market by Segment: Global System-in-Package Market, by Type, 2018-2023, 2024-2029 ($ millions) Global System-in-Package Market Segment Percentages, by Type, 2022 (%) 2D IC 2.5D IC 3D IC Global System-in-Package Market, by Application, 2018-2023, 2024-2029 ($ millions) Global System-in-Package Market Segment Percentages, by Application, 2022 (%) Consumer Electronics Communications Automotive & Transportation Aerospace & Defense Healthcare Others Global System-in-Package Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) Global System-in-Package Market Segment Percentages, By Region and Country, 2022 (%) North America US Canada Mexico Europe Germany France U.K. Italy Russia Nordic Countries Benelux Rest of Europe Asia China Japan South Korea Southeast Asia India Rest of Asia South America Brazil Argentina Rest of South America Middle East & Africa Turkey Israel Saudi Arabia UAE Rest of Middle East & Africa Competitor Analysis The report also provides analysis of leading market participants including: Key companies System-in-Package revenues in global market, 2018-2023 (estimated), ($ millions) Key companies System-in-Package revenues share in global market, 2022 (%) Further, the report presents profiles of competitors in the market, key players include: Amkor Technology ASE Jiangsu Changjiang Electronics Technology (JCET) Siliconware Precision Industries (SPIL) United Test and Assembly Center (UTAC) Outline of Major Chapters: Chapter 1: Introduces the definition of System-in-Package, market overview. Chapter 2: Global System-in-Package market size in revenue. Chapter 3: Detailed analysis of System-in-Package company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc. Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments. Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets. Chapter 6: Sales of System-in-Package in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world. Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc. Chapter 8: The main points and conclusions of the report.
1 Introduction to Research & Analysis Reports 1.1 System-in-Package Market Definition 1.2 Market Segments 1.2.1 Market by Type 1.2.2 Market by Application 1.3 Global System-in-Package Market Overview 1.4 Features & Benefits of This Report 1.5 Methodology & Sources of Information 1.5.1 Research Methodology 1.5.2 Research Process 1.5.3 Base
