Thick film hybrid integrated circuit (THIC) is a kind of hybrid integrated circuit, which is made of passive network on the same substrate by thick film process such as screen printing and sintering, and then assembled with discrete semiconductor chip or monolithic integrated circuit or micro component, and then packaged. The characteristics of thick film hybrid integrated circuit: compared with discrete component circuit, hybrid integrated circuit has the characteristics of high density, high reliability and better electrical performance; compared with PCB Compared with monolithic integrated circuit, it is flexible in design, simple in process, convenient in production of many varieties and small batch, and has wide parameter range, high precision, and can withstand high voltage and large output In terms of digital circuits, although semiconductor integrated circuits give full play to the characteristics of miniaturization, high reliability and large-scale low-cost production, thick film hybrid integrated circuits still maintain their advantages over semiconductor integrated circuits in many aspects, such as low-noise circuits, high-stability passive networks, high-frequency linear circuits High precision linear circuit, microwave circuit, high-voltage circuit, high-power circuit and mixed analog-to-digital circuit. According to our (Global Info Research) latest study, the global Thick-Film Hybrid Integrated Circuits market size was valued at USD 5847.8 million in 2022 and is forecast to a readjusted size of USD 8059.6 million by 2029 with a CAGR of 4.7% during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes. The main sales regions of thick film hybrid IC are Asia Pacific and North America, which together occupy about 60% of the global market share. This report is a detailed and comprehensive analysis for global Thick-Film Hybrid Integrated Circuits market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided. Key Features: Global Thick-Film Hybrid Integrated Circuits market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029 Global Thick-Film Hybrid Integrated Circuits market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029 Global Thick-Film Hybrid Integrated Circuits market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029 Global Thick-Film Hybrid Integrated Circuits market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2018-2023 The Primary Objectives in This Report Are: To determine the size of the total market opportunity of global and key countries To assess the growth potential for Thick-Film Hybrid Integrated Circuits To forecast future growth in each product and end-use market To assess competitive factors affecting the marketplace This report profiles key players in the global Thick-Film Hybrid Integrated Circuits market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include International Rectifier (Infineon), Crane Interpoint, GE Aviation, VPT (HEICO) and MDI, etc. This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence. Market Segmentation Thick-Film Hybrid Integrated Circuits market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets. Market segment by Type Al2O3 Ceramic Substrate BeO Ceramic Substrate Ain Substrate Others Market segment by Application Aviation and National Defense Automotive Industry Telecommunication and Computer Industry Consumer Electronics Others Major players covered International Rectifier (Infineon) Crane Interpoint GE Aviation VPT (HEICO) MDI MSK (Anaren) Technograph Microcircuits Cermetek Microelectronics Midas Microelectronics NAURA Technology Group Co., Ltd. JRM International Sensor Systems Zhenhua Microelectronics Ltd. Xin Jingchang Electronics Co.,Ltd E-TekNet China Electronics Technology Group Corporation Kolektor Siegert GmbH Advance Circtuit Technology AUREL s.p.a. Fenghua Advanced Technology Holding CO.,LTD, Custom Interconnect Integrated Technology Lab Chongqing Sichuan Instrument Microcircuit Co., Ltd. Market segment by region, regional analysis covers North America (United States, Canada and Mexico) Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe) Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia) South America (Brazil, Argentina, Colombia, and Rest of South America) Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa) The content of the study subjects, includes a total of 15 chapters: Chapter 1, to describe Thick-Film Hybrid Integrated Circuits product scope, market overview, market estimation caveats and base year. Chapter 2, to profile the top manufacturers of Thick-Film Hybrid Integrated Circuits, with price, sales, revenue and global market share of Thick-Film Hybrid Integrated Circuits from 2018 to 2023. Chapter 3, the Thick-Film Hybrid Integrated Circuits competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast. Chapter 4, the Thick-Film Hybrid Integrated Circuits breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029. Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029. Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Thick-Film Hybrid Integrated Circuits market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029. Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War. Chapter 13, the key raw materials and key suppliers, and industry chain of Thick-Film Hybrid Integrated Circuits. Chapter 14 and 15, to describe Thick-Film Hybrid Integrated Circuits sales channel, distributors, customers, research findings and conclusion.
1 Market Overview 1.1 Product Overview and Scope of Thick-Film Hybrid Integrated Circuits 1.2 Market Estimation Caveats and Base Year 1.3 Market Analysis by Type 1.3.1 Overview: Global Thick-Film Hybrid Integrated Circuits Consumption Value by Type: 2018 Versus 2022 Versus 2029 1.3.2 Al2O3 Ceramic Substrate 1.3.3 BeO Ceramic Substrate 1.3.4 Ain Substrate
