Summary Underfill is used to fill space beneath a die and adhere to its carrier. They add structural strength, increase impact resistance, bolster thermal cycling resistance and improve overall reliability. Underfill can be found in a wide variety of applications including mobile phone, game console, computor, tablet PC and digital camera. This report includes market status and forecast of global and major regions, with introduction of vendors, regions, product types and end industries; and this report counts product types and end industries in global and major regions. Market Segment as follows: By Region / Countries North America (U.S., Canada, Mexico) Europe (Germany, U.K., France, Italy, Russia, Spain etc) South America (Brazil, Argentina etc) Middle East & Africa (Saudi Arabia, South Africa etc) By Type Semiconductor Underfills Board Level Underfills By End-User / Application Industrial Electronics Defense & Aerospace Electronics Consumer Electronics (laptops, mobile phones, MP3 players, game consoles, digital cameras,etc.) Automotive Electronics Medical Electronics Others By Company Henkel WON CHEMICAL NAMICS SUNSTAR Hitachi Chemical Fuji Shin-Etsu Chemical Bondline AIM Solder Zymet Panacol-Elosol Master Bond DOVER Darbond HIGHTITE
Table of Contents 1 Market Definition 1.1 Market Segment Overview 1.2 by Type 1.3 by End-Use / Application 2 Global Market by Vendors 2.1 Market Share 2.2 Vendor Profile 2.3 Dynamic of Vendors 3 Global Market by Type 3.1 Market Share 3.2 Introduction of End-Use by Different Products 4 Global Market by End-Use / Application 4.1 Market Share 4.2 Overview of Co
